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september 2016 docid029626 rev 2 1 / 18 for further information contact your local stmicroelectronics sales office www.st.com STWLC04 qi based, 1 w optimized wireless power receiver data brief features ? 1 w output power ? qi 1.1 wireless standard communication protocol based ? integrated high efficiency synchronous rectifier ? 800 khz programmable step - down converter with input current and input voltag e regulation loop ? step - down converter efficiency up to 90% ? simplified li - ion/polymer charger function ? 32 - bit, 16 mhz embedded microcontroller with 16 kb rom and 2 kb ram memory ? 2 kb nvm for customization ? integrated driver for external supply switch ? pr ecise voltage and current measurements for received power calculation ? i 2 c interface ? configurable gpio output ? rx coil ntc protection ? thermal protection ? low power dissipative rectifier overvoltage clamp ? flip chip 77 bumps (3.12x4.73 mm) applications ? wearable applications ? smart watches ? glasses ? medical and healthcare instrumentation description the st wlc04 is an integrated wireless power receiver suitable for wearable applications. the device is designed for 1 - watt power transfer based on the qi protocol, with digital control and precise analog control loops ensuring stable operation. the i 2 c interface allows a high degree of customization and settings can be stored in the embedded non - volatile memory. the STWLC04 can deliver the output power in two modes: as a power supply with configured output voltage or as a simple cc/cv battery charger with configu rable charging current, charging voltage and termination current. the STWLC04 can detect the external (wired) power supply connection and drive an external power switch. table 1: device summary order code description package packing STWLC04jr wearable optimized 1 w output flip chip 77 bumps (3.12x4.73 mm) tape and reel
contents STWLC04 2 / 18 docid029626 rev 2 contents 1 introduction ................................ ................................ ..................... 3 2 pin configuration ................................ ................................ ............. 4 3 maximum ratings ................................ ................................ ............. 7 4 application information ................................ ................................ .. 9 4.1 application schematic and recommended external components ....... 9 4.2 external passive component selection ................................ ............ 12 4.2.1 input resonant circuit component selection (l1, c1, c2) ................. 12 4.2.2 voltage clamp resistor selection (rcl1, rcl2) ............................... 12 4.2.3 load modulation capacitor selection (cm1, cm2) ........................... 13 4.2.4 feedback resistor divider component selection (rfb1, rfb2) ....... 13 4.2.5 rx ntc circuit component selection (rntc, r1) ............................ 13 4.2.6 soft - start capacitor selection (c10) ................................ .................. 13 4.2.7 exter nal supply transistor selection ................................ .................. 13 4.3 reference pcb layout ................................ ................................ ..... 14 5 package information ................................ ................................ ..... 15 5.1 flip chip 77 bumps (3.12x4.73 mm) package information .............. 15 6 revision history ................................ ................................ ............ 17
STWLC04 i ntroduction docid029626 rev 2 3 / 18 1 introduction the STWLC04 is an advanced, integrated receiver ic for wireless power transceiver in wearable applications optimized for 1 w. it works as a voltage source with regulated output voltage, typically 5 v an d can also be reconfigured into a simple battery charger mode (cc/cv) to charge directly li - ion or li - pol batteries. the STWLC04 can operate fully autonomously or can be controlled through i 2 c by the host system. see the figure below. figure 1 : simplified block schematic
pin configuration STWLC04 4 / 18 docid029626 rev 2 2 pin configuration figure 2 : pin configuration flip chip 77 bumps (3.12x4.73 mm) table 2: pin descripti on pin name pin position description csp 77l ac1 f6, f7, g7 rx coil circuit terminal connection ac2 e9, e10, e11 rx coil circuit terminal connection mod1 g6 load modulation capacitor 1 connection mod2 f11 load modulation capacitor 2 connection clmp 1 g5 clamping capacitor/resistor 1 connection clmp2 f9 clamping capacitor/resistor 2 connection rmod e7 modulation current sink connection, internally connected to vrect rmod1 g11 load modulation external resistor connection. rm resistor is not necessa ry for most applications vrect f10, g10 synchronous rectifier output boot1 g8 bootstrap capacitor connection for the rectifier boot2 e8 bootstrap capacitor connection for the rectifier boot g9 bootstrap capacitor connection for the step - down converter clamp f8 low power clamp connection vsup a8, b8, b7 power supply input for the step - down converter
STWLC04 pin configuration docid029626 rev 2 5 / 18 pin name pin position description vsups a7, c6 sensing terminal of the external current sensing resistor resl a6 sensing terminal of the external current sensing resistor vout d5 step - do wn output voltage vfb a5 step - down feedback input fbgnd b6 ground connection of the resistor feedback divider for step - down converter lx a11, b11, b10 step - down converter coil connection ntcrx a3 comparator input for rx coil temperature sensing ntc thermistor has to be placed close to rx coil va a4 ldo1 output to filtering capacitor. adc supply and sensitive analog circuitries are connected to this ldo; any external circuit cannot be connected to this node vcore f2 ldo2 output to filtering capacito r. the microcontroller core and logic supply. vcore voltage can be used as a reference voltage for the rx coil ntc divider v5v a9, b9 ldo3 output to filtering capacitor vio g1 vio, power supply for the digital interface, can be connected to vcore or prov ided externally scl d1 i 2 c clock input sda d4 i 2 c data gpio0 d6 general purpose push - pull i/o pin. this function depends on firmware configuration gpio1 e5 general purpose push - pull i/o pin. this function depends on firmware configuration gpio2 e4 gen eral purpose push - pull i/o pin. this function depends on firmware configuration gpio3 e1 open drain output only pin. this function depends on firmware configuration reset d2 chip reset input, active low int c3 open drain interrupt output to the host pla tform rpgnd d8, d9, d10, d11 rectifier power ground bpgnd c8, c9, c10, c11 step - down converter power ground gnd g2, f3 digital ground agnd b4, c4, b5, c5 analog ground vext a10 detection of the external power supply voltage C adapter/usb voltage, 30 v spike tolerant swdrv d7 external p - channel switch control to connect the adapter/usb voltage to vout usbok c2 digital input for the usbok signal from platforms comp c7 step - down converter soft - start capacitor connection
pin configuration STWLC04 6 / 18 docid029626 rev 2 pin name pin position description gnd g4, f4 reserved. connect to ground vcore a1 reserved. connect to vcore n/c g3 reserved. do not connect gnd b1, e2, e6, f1 reserved. connect to ground n/c b2, b3, d3, e3 reserved. do not connect gnd c1 reserved. connect to ground n/c a2, f5 reserved. do not connect
STWLC04 maximum ratings docid029626 rev 2 7 / 18 3 maximum ra tings table 3: absolute maximum ratings pin parameter value unit ac1, ac2 input ac voltage - 0.3 to 20 v mod1, mod2 modulation transistor voltage - 0.3 to 20 v clmp1, clmp 2 clamp transistor voltage - 0.3 to 20 v boot1, boot2 voltage on bootstraps ac1, ac2 - 0.3; ac1, ac2 + 6 v boot voltage on bootstrap vrect - 0.3; vrect + 6 v vrect rectified voltage - 0.3 to 20 v vresl, vsups current sensing resistor connection voltage - 0 .3 to 20 v vresl - vsups voltage on the current sensing resistor - 0.3 to 2 v vsup input voltage of the buck converter - 0.3 to 20 v lx buck converter switching node voltage - 0.3 to 20 v rmod, rmod1 resistive modulation current source and transistor voltag e - 0.3 to 20 v fbgnd internal feedback transistor vds voltage - 0.3 to 20 v vout output voltage range - 0.3 to 20 v vfb buck converter feedback voltage - 0.3 to 3 v vext, swdrw detection pin for the external voltage and driver output for the external tran sistor - 0.3 to 30 v ntcrx rx coil ntc voltage - 0.3 to 2.3 v va, vcore ldo1, 2 voltages - 0.3 to 2.3 v v5v ldo 3 voltage - 0.3 to 6 v vio vio voltage - 0.3 to 6 v scl, sda, usbok, int, reset digital interface voltage - 0.3 to vio+0.3 v gpio0, gpio1, gpio2 , gpio3 general purpose i/o voltage - 0.3 to vio+0.3 v t stg storage temperature range - 40 to 150 c t op operating ambient temperature range - 40 to +85 c t j maximum junction temperature +125 c esd machine model 100 v charged device model 500 v hu man body model 2000 v
maximum ratings STWLC04 8 / 18 docid029626 rev 2 absolute maximum ratings are those values beyond which damage to the device may occur. functional operation under these conditions is not implied. table 4: thermal data package symbol parameter value unit csp 3.12x4.73 77l r thja junction to ambient thermal resistance (1) 35 c/w notes: (1) this parameter corresponds to the pcb board, 4 - layers with 1 inch 2 of cooling area.
STWLC04 application information docid029626 rev 2 9 / 18 4 application information 4.1 application schematic and recommended external components figure 3 : STWLC04 application schematic c8 and trswdrv are optional if vext detection is disabled.
application information STWLC04 10 / 18 docid029626 rev 2 figure 4 : STWLC04 charger configuration before connecting the battery, the STWLC04 has to be configured as a battery charger in nvm. table 5: STWLC04 recommended external components component manufacturer part number value size l1 wurth 760308101208 13 uh d10x1.68 mm tdk wr111118 - 36 - f5 - b1 18 h d11x1.4 mm l2 toko mfd160806 - 1r0 1 h/600 ma 0603 c1 murata 4x grm155r61h473ke19 47nf/x7r 0402 c2 murata grm155r71h332ka01 3.2 nf/c0g 0402 c3, c5 murata grm155r61a106me11 10 f/10 v 0402 c4 murata grm155r61a105ke15d 1 f/10 v 0402 cboot1, cboot 2, cboot, c11 murata grm033r61a104ke84d 100 nf/10 v 0201 c6, c7, c13 murata grm033r60j105mea2d 1 f/6.3 v 0201 c10 murata grm035r60j475me15d 4.7 uf/6.3 v 0201 cm1 murata grm155r71h473ka12 47 nf/50 v 0402 cm2 murata grm155r71h472ka12 4.7 nf/50 v 0402 r cl1, rcl2 panasonic erj - pa2j150v 15r 0402 cfb murata grm0335c1h150ja01 15 pf 0201 rs panasonic p.10akct 0.1 /1% 0402 r1 51 k 0201 rfb1 stackpole rgc0201dtd150k - nd 150 k 0201 rfb2 te - connectivity 7 - 2176074 - 1 30.9 k 0201 rntc murata 100 k 0402 cchg (filter) murata 3x grm155r61a106me11 10 f/10 v 0402 lchg (filter) murata lqb15nnr47j10d 470 nh 04 02 rload 100 0201
STWLC04 application information docid029626 rev 2 11 / 18 all the above components refer to a typical application. operation of the device is not limited to the choice of these external components. figure 5 : vio and digital interface in standalone application schematic
application information STWLC04 12 / 18 docid029626 rev 2 figure 6 : vio and digital interface in platform application schematic 4.2 external passive component selection 4.2.1 i nput resonant circuit component selection (l1, c1, c2) rx coil selection should be optimized by the requested transferred power. the ind uctance of the coil together with c 1 and c 2 capacitors create an input resonant circuit. components have to be carefully selected both to keep the resonant frequency compliant with the wireless standard specification and also to deliver the power. for more details please see wireless standard specifications. the following equations list the resonant frequencies: equation 1: ? ? = 1 2 ? ? ? ? 1 ? ? 1 equation 2: ? ? = 1 2 ? ? ? ? 1 ? ( 1 ? 1 + 1 ? 2 ) it is recommended high grade ceramic capacitors to be used with c0g dielectrics type. x5r, x7r capacitors can be used for 5 w output power applications. 4.2.2 voltage clamp resistor selection (rcl1, rcl2) the purpose of these resistors is to load the rectifier output by decreasing the rectified voltage below o vervoltage threshold C hysteresis (v ovp - v ovphyst ), when v ovp is reached. 0.2 w resistors with pulse - withstanding character are recommended for this application.
STWLC04 application information docid029626 rev 2 13 / 18 4.2.3 load modulation capacitor selection (cm1, cm2) these capacitors fulfill the backscatter modulation of the communication from the receiver to the transmitter. x5r dielectrics type capacitors are suitable for this purpose. 4.2.4 feedback resistor divider component selection (rfb1, rfb2) feedback voltage divider gives the ratio between the desired step - down converter output vol tage and the given feedback reference voltage. the r fb1 and r fb2 resistors should be 0.1% or 0.5% precision. 4.2.5 rx ntc circuit component selection (rntc, r1) to protect the receiver coil from overtemperature, the STWLC04 is equipped with a comparator input. if the input voltage crosses a certain level, the STWLC04 reacts terminating the power transfer and sending an interrupt to the host system C depe nding on the configuration. the input voltage is given as a ratio from r ntc thermistor and r 1 common resistor divider. the divider can be supplied from ldo1 (va pin) filtering capacitor. 4.2.6 soft - start capacitor selection (c10) the soft - start capacitor c10 connected to comp pin influences the ramp - up time of the step - down converter. the nominal v ref voltage is 1.2 v and the time needed to reach the nominal vol tage is given by the following equation: equation 3: ? ????????? = ? ? 10 6 ? ???? [ ? , ? , ? , ? ] example: 470 nf ~ 560 ms 4.2.7 external supply transistor selection the device contains the function of the connection external voltage supply directly to v out by the external dual p - channel transistor back - to - back connected so to avoid the leakage from v out to the external voltage supply.
application information STWLC04 14 / 18 docid029626 rev 2 4.3 reference pcb layout figure 7 : top overlay figure 8 : top layer figure 9 : mid layer 1 figure 10 : mid layer 2 figure 11 : bottom layer
STWLC04 package information docid029626 rev 2 15 / 18 5 package information in order to meet environmental requirements, st offers these devic es in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. 5.1 flip chip 77 bumps (3.12x4.73 mm) p ackage information figure 12 : flip chip 77 bumps (3.12x4.73 mm) package outline
package information STWLC04 16 / 18 docid029626 rev 2 table 6: flip chip 77 bumps (3.12x4.73 mm) package mechanical d ata dim. mm min. typ. max. a 0.50 0.55 0.60 a1 0.17 0.20 0.23 a2 0.28 0.30 0.32 b 0.23 0.26 0.29 d 4.67 4.70 4.73 d1 4.00 e 3.06 3.09 3.12 e1 2.40 e 0.40 sd 0.20 se 0.20 fd 0.352 fe 0.346 $ 0.05 ccc 0.075 the termina l a1 on the bump side is identified by a distinguishing feature (for instance by a circular "clear area", typically 0.1 mm diameter) and/or a missing bump. the terminal a1 on the backside of the product is identified by a distinguishing feature (for instan ce by a circular "clear area", typically between 0.1 and 0.5 mm diameter, depending on the die size). figure 13 : flip chip 77 bumps (3.12x4.73 mm) recommended footprint
STWLC04 revision history docid029626 rev 2 17 / 18 6 revision history table 7: document revision history date revision changes 10 - aug - 2016 1 initial release. 06 - sep - 2016 2 updated the cover image, the section "features" and the section "description" .
STWLC04 18 / 18 docid029626 rev 2 important notice C please read carefully stmicroelectronics nv and its subsidiaries (st) reserve the right to make changes, correcti ons, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant information on st products before placing orders. st products are sold pursuant to sts terms and conditions of sale in place at the time of order acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for applicati on assistance or the design of purchasers products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st f or such product. st and the st logo a re trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2016 stmicroelectronics C all rights reserved

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